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德律TR7006L出租/SPI出租/TR7006L租赁

TRI 7006L 3D SPI

2008 Vintage
High speed 3D Solder paste inspection system
18x20" board size 460x510mm
220V

The TR7006 three-dimensional Solder Paste Inspection System tester can quickly detect the thickness of every solder joint and any open or short circuits. With this, the long-existing handicap with two-dimensional testing is solved. The System targets small products and prevents them from having bad connections as a result of small solder joints, lack of solder, component vibrations and heat expansions. With this, the overall quality of the product itself and productivity are improved.

Main General Features:

• Ultra High Speed
• Immediate identification of Solder Paste Defects
• Fast, Easy Programming
• Continuous Warpage Tracking Compensation
• Complete Statistical Process Control Output
• Real 3D Solder Paste Inspection Read-On-The-flying
• Statistical Process Control Output provided
• Unmatched resolution, repeatability and accuracy
• Incorporates the leading-edge TRI-Laser speed scan system

Summary of Technical Features

• Full 3D scan at 71cm2/sec (11in2/sec), 20gm (optical resolution)
• Imaging with Parallel 1280 lazer Scan
• Inspection PC-ATX board (300mm x 210mm) in less than 30 sec
• Repeatable and accurate results even on small CSP and 0201
• 8X programmable resolution range from 10 to 80gm meets the requirements for fine pitch PCBA and speed critical applications
• Both 2D and 3D height images are available at run time for defect review and inspection program editing
• Users can define the ranges for the height, area and volume of the solder.
• Uses the colour image to display the distribution of the solder height

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